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Ball Corporation / Ball Aerospace Materials and Process Control Engineer Principal - Printed Circuit Boards, Tetra Etch, Metal Finish in Westminster, Colorado

Powered by endlessly curious people with an unwavering mission focus, Ball Aerospace pioneers discoveries that enable our customers to perform beyond expectation and protect what matters most.

We create innovative space solutions, enable more accurate weather forecasts, drive insightful observations of our planet, deliver actionable data and intelligence, and ensure those who defend our freedom go forward bravely and return home safely. For more information, visit Ball Aerospace Career Site at or connect with us on LinkedIn at , Facebook at , Twitter at or Instagram at .

The Engineering Strategic Support Unit comprises the organizational talent and technical leadership that enables the successful delivery of high-impact discriminating technologies for our customers’ missions. Our collaborative, cross-functional teams are committed to innovation, integrity, continual learning and strong execution.

Materials and Process Control Engineer Principal – Printed Circuit Boards, Tetra Etch, Metal Finish

What You’ll Do:

  • Develop, implement and commission materials and processes (M&P) plans for tactical hardware, including leading efforts to qualify new materials and processes in printed circuit work center, tetra etch, and metal finishing.

  • Review engineering drawings and provide feedback to designers on materials selection, producibility, and process specifications.

  • Ownership, development and investigation of new tools, equipment and manufacturing techniques to lead the operations into the future.

  • Troubleshoot and investigate hardware anomaly root causes and corrective actions.

  • Establishment, refinement and execution of the printed circuit work center, tetra etch, and metal finishing engineering strategy.

  • Work cross functionally with Manufacturing and Materials Engineers and work center technicians to develop new strategies, design requirements and processes for Program execution

  • Coordinate and conduct all tests required for validating materials and their performance and provide clear concise documentation and direction on corrective actions.

  • Maintain compliance with all requirements, including, but not limited to: EHS, NQA and internal and external audits.

  • Work cross functionally with Mechanical and Manufacturing Engineering to develop best practices for etch tooling.

  • Continuously and incrementally develop and improve all silicone robotic processes and documentation as standardized work.

  • Perform failure analysis on hardware anomalies.

  • Develop robust processes such as chemical etching, chemical tin plating, oxide, and electroplating to meet customer dimensional and functional requirements.

  • Develop and maintain Standard Operating Procedures, work instructions and other documents for each work center to ensure best operational practices.

  • Apply industry accepted manufacturing engineering techniques, practices and procedures to our environment.

  • Work with cross-functional teams to develop and implement effective and efficient processes.

  • Maintain excellent rapport with internal/external customers.

  • Lead teams through projects.

  • Maintain a regular and predictable work schedule.

  • Establish and maintain effective working relationships within the department, the Strategic Business Units, Strategic Support Units and the Company. Interact appropriately with others in order to maintain a positive and productive work environment.

  • Perform other duties as necessary.

What You’ll Need:

  • BS degree or higher in Engineering or a related technical field is required plus 12 or more years related experience.

  • Each higher-level degree, i.e., Master’s Degree or Ph.D., may substitute for two years of experience. Related technical experience may be considered in lieu of education. Degree must be from a university, college, or school which is accredited by an agency recognized by the US Secretary of Education, US Department of Education.

  • Motivated self-starter.

  • Project management skills.

  • Proven interpersonal skills and the ability to work well as a team player.

  • Excellent verbal, written, and listening communication skills.

  • Low volume / high mix manufacturing experience is desired.

  • Etching and PCB fabrication experience desired.

  • Experience with the implementation of Lean initiatives.

  • Proficient with MS Suite and Excel; experience with AutoCAD and SolidWorks is a plus.

  • Experience performing capacity demand analysis.

Working Conditions:

  • Work is performed in an office, laboratory, production floor, or clean room, outdoors or remote research environment.

  • May occasionally work in production work centers where use of protective equipment and gear is required.

  • May access other facilities in various weather conditions.

  • Travel and local commute between Ball campuses and other possible non-Ball locations may be required.

A current DoD clearance and/or SCI access with Polygraph is not required to be eligible for this position, however applicant must be willing and eligible for submission within 60-90 days after an offer is accepted and must be able to maintain the applicable clearance/access. By applying to this position, you are agreeing to complete a National Security Clearance Pre-Screen Questionnaire to evaluate your general ability to obtain the required security clearance or government customer access associated with this position.

Relocation for this position is available.


Ball Aerospace is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.

Equal Opportunity Employer

Minority, Female, Disabled, Lesbian, Gay, Bi-sexual, Transgender and Veterans