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Ball Corporation / Ball Aerospace Technical Intern - Detector Packaging in Boulder, Colorado

Powered by endlessly curious people with an unwavering mission focus, Ball Aerospace pioneers discoveries that enable our customers to perform beyond expectation and protect what matters most.

We create innovative space solutions, enable more accurate weather forecasts, drive insightful observations of our planet, deliver actionable data and intelligence, and ensure those who defend our freedom go forward bravely and return home safely. For more information, visit Ball Aerospace Career Site at https://jobs.ball.com/aerospace/ or connect with us on LinkedIn at https://www.linkedin.com/company/ball-aerospace , Facebook at https://www.facebook.com/ballaerospace/ , Twitter at https://twitter.com/BallAerospace or Instagram at https://www.instagram.com/ballaerospace/ .

The Engineering Strategic Support Unit comprises the organizational talent and technical leadership that enables the successful delivery of high-impact discriminating technologies for our customers’ missions. Our collaborative, cross-functional teams are committed to innovation, integrity, continual learning and strong execution.

The Ball Aerospace Internship Program is a 10-week summer program that provides interns with practical experience working on relevant projects while working with designated mentors; access to state-of-the-art equipment; a competitive wage; relocation reimbursement; in-house training; group activities; possible future employment and the ability to participate in the Ball Aerospace Remote Sensing Team (BIRST) program to build and launch a rocket or high-altitude balloon. At the conclusion of your internship, you will be required to prepare and deliver a formal presentation of your project work to your respective department.

Technical Intern - Detector Packaging

DTC packaging engineers work on interdisciplinary teams that design, manufacture and test the world’s most advanced focal plane assemblies. Detector packaging draws from many disciplines including mechanical, electrical, materials and optical engineering.

What You’ll Do:

  • May participate in process optimization, material characterization or manufacturing yield improvement.

  • Depending on background and skills, may also assist with experimental design, mechanical design or drawing preparation and release.

  • This type of engineering is very much “hands on” so you could find yourself working in a cleanroom on state-of-the art assembly and test equipment.

  • Maintain a regular and predictable work schedule.

  • Establish and maintain effective working relationships within the department, the Strategic Business Units, Strategic Support Units and the Company. Interact appropriately with others in order to maintain a positive and productive work environment.

  • Perform other duties as necessary.

What You’ll Need:

  • Must have completed your sophomore or junior year and be enrolled in a degree program for the fall of 2021. We will also accept students enrolled in a post graduate program.

  • Degree must be from a university, college, or school which is accredited by an agency recognized by the US Secretary of Education, US Department of Education.

  • Mechanical engineering, physics, chemistry, chemical engineering, materials, electrical engineering degree fields.

  • Material science coursework preferred.

  • Hands-on laboratory experience in handling, processing and assembling hardware containing delicate components (optics, semiconductor fab, microelectronics)

  • Hands-on experience using a stereo-microscopes and micro-scope based assembly/alignment equipment.

  • Hands-on experience with operating processing equipment (e.g. ovens, furnaces, cleaning stations, thin film deposition).

  • Good phone skills and proven experience selecting laboratory equipment and/or component technology (looking for supplier research skills).

  • Strong interpersonal and writing skills.

  • Mechanical design / CAD software experience is a plus.

  • Experience/understanding of the following technologies is a plus:

  • Die attach, wire bonding; adhesive technology; interconnect technologies including soldering; optical bonding techniques; cleaning techniques such as vacuum bake, plasma etch, and liquid chemical processes; precision alignment; cryogenics; assembly protocols in class 100 cleanroom; thin film deposition; thermal control, structural designs and contamination mitigation.

Working Conditions:

  • Work is performed in an office environment, laboratory, cleanroom, or production floor.

  • Travel and local commute between Ball campuses and other possible non-Ball locations may be required.

Relocation for this position is available.

US CITIZENSHIP MAY BE REQUIRED

Ball Aerospace is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.

Equal Opportunity Employer

Minority, Female, Disabled, Lesbian, Gay, Bi-sexual, Transgender and Veterans

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